Features & Benefits
● DC to 26.5 GHz (SMA), 40 GHz (2.92 mm), 50 GHz (2.4 mm), 67 GHz(1.85 mm) & 110 GHz (1 mm)
● Solderless and Installation Convenience
● Provide Optimal Signal Integrity
● To reduce The Space
● Suitable for Various Board Materials and Thicknesses
Applications
● High-speed Digital Test Boards
● Signal Integrity Measurements
● Semiconductor Verification Boards
● Multi-channel Tests System
● SERDES applications
Design Assistance
●3D Model for Mechanical Layout
● 3D Model for Simulation
● Recommended Printed circuit board Layout
Materials
● Body: SUS303, Passivated
● Contact: BeCu, C17300 Gold plated
● Center Contact Capture: PEI
